SAW wafers
Langasite wafers for SAW applications
| Diameter, mm: | 76.2 and 100 (3″ and 4″) |
| Thickness, mm | 0.35 and 0.5 |
| Reference flat, mm | 22-32 |
| Flatness (for pressed wafer) | In accordance with International Electrotechnical Commission "IEC" of 01/28/2005 |
| Bow | |
| Front surface finish (polished) | |
| Back surface finish (lapped) | |
| Orientation* | xyl/48.5°/26.7° |
| *Any orientations are possible | |
SAW Wafer Specification Worksheet (
doc, 172 KB)
